Wire Saws & Wafer Equipment

Multi-Wafer Maker

Automatic Cleaning Machine

Orientation Measuring, Gluing System

Slurry Recycle System

Micro-Precision Double Disc Grinder

Our Multi-Wafer Maker and its peripheral equipment hold the No. 1 sales record in the world.

To meet various customers´ needs, we manufacture a wide range of the series from a small light-duty model to an ultra large heavy-duty model and various peripheral equipment which support these cutting machines. We are challenging ourselves everyday for the goal of “More accurate”, “Thinner” and “Better yield”.

NIPPEI TOYAMA Europe GmbH      Eisenstraße 3     65428 Rüsselsheim / Germany
Phone +49 (0) 6142 / 79660-0      Fax +49 (0) 6142 / 82 06 10